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 TCD2950D
Preliminary TOSHIBA CCD Image SensorCCD (charge coupled device)
TCD2950D
The TCD2950D is a high sensitive and low dark current 10680 elements x 6 line CCD color image sensor which includes CCD drive circuit and clamp circuit. The sensor is designed for scanner. The device contains a row of 10680 elements x 6 line staggered photodiodes which provide a 96 lines/mm (2400DPI) across a A4 size paper. The device is operated by 5 V pulse, and 12 V power supply.
Features
* * * * * * * * * Number of image sensing elements: 10680 elements x 6 line Image sensing element size: 2.8 m by 4 mm on 4 m centers Photo sensing region: High sensitive and low dark current PN photodiode Distance between photodiode array: 64 m (16 lines) Clock: 2 phase (5 V) Power supply: 12 V power supply voltage Internal circuit: Clamp circuit Package: 22 pin CERDIP package Color filter: Red, green, blue Weight: 5.2 g (typ.)
Pin Connections (top view)
OS3 SS Symbol VB VSH
V RS V CP
1 1 1 2 3 4 5 6 7 8 9 21360 21360 21360 G R B 1
22 21 20 19 18 17 16 15 14 13 12
OS2 OS1 OD
CP
Maximum Ratings (Note1)
Characteristics Clock pulse voltage Shift pulse voltage Reset pulse voltage Clamp pulse voltage Power supply voltage Operating temperature Storage temperature Rating Unit
RS
SS NC -0.3~8.0 V f1A1 f2A1 -0.3~15 0~60 -25~85 V C C f2A2 f1A2
SS f1A4 f2A4 f2A3 f1A3 SH1 SH2
VOD Topr Tstg
Note1:
All voltage are with respect to SS terminals (ground).
SH3 10 SS 11
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TCD2950D
Circuit Diagram
OD 20
CP
SS 18
f1A4 f2A4 17 16
f2A3 f1A3 15 14
19
CCD ANALOG SHIFT REGISTER 1 SHIFT GATE 1 S21357 S21359 D64 D66 PHOTO DIODE (B) PHOTO DIODE (B) 74 D76 D14 D16 D18 D60 D62 S1 S3 13 SH1
S21356 S21358 S21360 D65
OS1 21
CLAMP D13 D15 D17 D59 D61 D63 S2 S4
SHIFT GATE 2 CCD ANALOG SHIFT REGISTER 2
CCD ANALOG SHIFT REGISTER 3 SHIFT GATE 3 S21357 S21359 D64 D66 PHOTO DIODE (G) PHOTO DIODE (G) 74 D76 D14 D16 D18 D60 D62 S1 S3 S5 12 SH2
S21356 S21358 S21360 D65
OS2 22
CLAMP D13 D15 D17 D59 D61 D63 S2 S4
SHIFT GATE 4 CCD ANALOG SHIFT REGISTER 4
CCD ANALOG SHIFT REGISTER 5 SHIFT GATE 5 S21357 S21359 D64 D66 PHOTO DIODE (R) PHOTO DIODE (R) 74 D76 D14 D16 D18 D60 D62 S1 S3 S5 10 SH3
S21356 S21358 S21360 D65 8
OS3 1
CLAMP D13 D15 D17 D59 D61 D63 S2 S4
SHIFT GATE 6 CCD ANALOG SHIFT REGISTER 6
3 SS
RS
4
6
7
73 D75 9 11 SS
SS f1A1 f2A1
f2A2 f1A2
73 D75
73 D75
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TCD2950D
Optical/Electrical Characteristics (Ta = 25C, VOD = 12 V, VB = VSH =V RS = V CP = 5 V (pulse), fB = 1 MHz, f RS = 2 MHz,
tINT = 11 ms, LIGHT SOURCE = A LIGHT SOURCE + CM500S FILTER (t = 1 mm), LOAD RESISTANCE = 100 kW) W
Characteristics Red Sensitivity Green Blue Photo response non uniformity Register imbalance Saturation Output Voltage Saturation Exposure Dark signal Voltage Dark Signal Non Uniformity DC Power Dissipation Total Transfer Efficiency Output Impedance DC Compensation Output Voltage Random Noise Reset Noise Masking Noise Symbol R(R) R(G) R(B) PRNU (1) PRNU (3) RI VSAT SE VDRK DSNU PD TTE ZO VOS NDI VRSN VMS Min 0.9 1.3 0.9 3/4 3/4 3/4 2.9 1.16 3/4 3/4 3/4 92 3/4 5.0 3/4 3/4 3/4 Typ. 1.4 1.9 1.3 15 3 1 3.5 1.84 0.5 2.0 420 98 0.3 6.0 0.8 0.3 0.2 Max 1.9 2.5 1.7 20 12 3/4 3/4 3/4 2.0 7.0 585 3/4 1.0 7.0 3/4 1.0 1.0 % mV % V lxs mV mV mW % kW V mV V V V/lxs Unit
Note
(Note 2)
(Note 3) (Note 4) (Note 5) (Note 6) (Note 7) (Note 8) (Note 8) 3/4 3/4 3/4 (Note 9) (Note 10) (Note 9) (Note 9)
Note 2: Sensitivity is defined for each color of signal outputs average when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. Note 3: PRNU (1) is defined for each color on a single chip by the expressions below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. PRNU (1) =
,x 100 (%) x
Where x is average of total signal output and DX is the maximum deviation from x . The amount of incident light is shown below. Red = 1/2*SE Green = 1/2*SE Blue = 1/4*SE Note 4: PRNU (3) is defined as maximum voltage with next pixels, where measured at 5% of SE (typ.). Note 5: Register imbalance is defined as follows.
21359
RI =
n =1
a
xn - x (n + 1)
21359 x
100 (%)
Note 6: VSAT is defined as minimum saturation output of all effective pixels. Note 7: Definition of SE SE =
VSAT RG
(lxs)
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TCD2950D
Note 8: VDRK is defined as average dark signal voltage of all effective pixels. DSNU is defined as different voltage between VDRK and VMDK when VMDK is maximum dark signal voltage.
VDRK VMDK DSNU
Note 9: DC signal output voltage is defined as follows. Reset noise voltage is defined as follows. Masking noise voltage is defined as follows.
VRSN
OS
VMS VOS
SS
Note 10: Random noise is defined as the standard deviation (sigma) of the output level difference between two adjacent effective pixels under no illumination (i.e. darkconditions) calculated by the following procedure.
video output Output waveform (effective pixels under dark condition) video output
200 ns 200 ns pixel (n) DV
pixel (n + 1)
(1) (2) (3) (4)
Two adjacent pixels (pixel n and n + 1) in one reading are fixed as measurement points. Each of the output level at video output periods averaged over 200 ns period to get V (n) and V (n + 1). V (n + 1) is subtracted from V (n) to get DV. DV = V (n) - V (n + 1) The standard deviation of DV is calculated after procedure (2) and (3) are repeated 30 times (30 readings). DV = 1 30 a | Vi | 30 i=1 I= 1 30 2 a (| DVi |DV ) 30 i=1
(5) (6)
Procedure (2), (3) and (4) are repeated 10 times to get sigma value. 10 sigma values are averaged.
I= (7)
1 10 aI 10 j = 1 j
I value calculated using the above procedure is observed 2 times larger than that measured relative to the ground level. So we specify random noise as follows.
NDI =
1 2
I
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TCD2950D
Operating Condition
Characteristics Clock pulse voltage "H" level "L" level "H" level "L" level "H" level "L" level "H" level "L" level Symbol VBA Min 4.5 0 4.5 0 4.5 0 4.5 0 11.4 Typ. 5.0 3/4 5.0 3/4 5.0 3/4 5.0 3/4 12.0 Max 5.5 0.3 5.5 0.5 5.5 0.5 5.5 0.5 13.0 Unit V Note
Shift pulse voltage
VSH
V
Reset pulse voltage
V RS
V
Clamp pulse voltage Power supply voltage
V CP
V V
VOD
Clock Characteristics (Ta = 25C)
Characteristics Clock pulse frequency Reset pulse frequency Clamp pulse frequency Clock capacitance Shift gate capacitance Reset gate capacitance Clamp gate capacitance (Note 11) Symbol fBA
f RS f CP
Min 0.15 0.3 0.3 3/4 3/4 3/4 3/4
Typ. 1.0 2.0 2.0 400 50 10 10
Max 10 10 10 3/4 3/4 3/4 3/4
Unit MHz MHz MHz pF pF pF pF
CBA CSH
CRS CCP
Note 11: VOD = 12 V
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TCD2950D
Timing Chart (bit clamp mode)
tINT (integration time)
SH
B1A
B2A
RS
CP
D73
D77 D76 D75
D16 D15 D14 D13 D12 D11 D10 S3 S2
D67 D66 D65 D64 S21360 S21359
S1 D63 D62 D61 D60 D59 D58
D4 D3 D2 D1 D0
D3 D2 D1 D0
OS
DUMMY OUTPUTS (13 elements)
LIGHT SHIELD OUTPUTS (47 elements)
DUMMY OUTPUTS (8 elements) (3 elements) SIGNAL OUTPUTS (21360 elements) DUMMY OUTPUTS (14 elements)
TEST OUTPUT (2 element) DUMMY OUTPUT (1 element)
DUMMY OUTPUTS (64 elements)
1 LINE READOUT PERIOD (21438 elements)
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TCD2950D
Timing Requirements
t2 SH t1 f1A t5 f2 GND 3.5 V (max) 1.5 V (min) 3.5 V (max) 1.5 V (min) t3 t4
f1
RS
t18
CP
f1 t6 f2 t7
RS
t15 t9
CP
t14
t8
t10
t16 t12
t17
t11
t13
OS
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TCD2950D
Timing Requirements
Characteristics Pulse timing of SH and f1A SH pulse rise time, fall time SH pulse width f1, f2 pulse rise time, fall time
RS pulse rise time, fall time RS pulse width CP pulse rise time, fall time CP pulse width
Symbol t1 t5 t2, t4 t3 t6, t7 t8, t10 (Note 12) t9 t11, t13 t12 t14 t15 t16, t17 t18
Min 110 200 0 1000 0 0 15 0 20 10 0 3/4 0
Typ. (Note11) 1000 1000 50 2000 50 20 100 20 100 40 100 15 500
Max 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4
Unit ns ns ns ns ns ns ns ns ns ns ns ns
Pulse timing of f1A, f2A and CP Pulse timing of RS and CP Video data delay time Pulse timing of SH and CP (Note 13)
Note 12: TYP is the case of f RS = 2.0 MHz. Note 13: Load resistance is 100 kW.
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TCD2950D
Typical Spectral Response
Spectral response
1.0 Ta = 25C Red
0.8
Relative response
Blue 0.6
Green
0.4
0.2
0 400
450
500
550
600
650
700
Wave length l
(nm)
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TCD2950D
Typical Drive Circuit
+5 V 0.1 mF/25 V 12 V
f1A3 f1A4 f2A3 f2A4
CP
0.1 mF/25 V
10 mF/25 V
IC1 22 21 20 19
CP
18
17
16
15
14
13
12 +5 V 0.1 mF/25 V
OS2 OS1 OD
SS f1A4 f2A4 f2A3 f1A3 SH1 SH2 TCD2950D
OS3 SS 1 2
RS
SS 4
NC f1A1 f2A1 f2A2 f1A2 SH3 5 6 7 8 9 10
SS 11
3
SH1 SH2 SH3
RS
+12 V
0.1 mF/25 V R1 10 mF/25 V TR1 OS1 OS2 OS3 R2 R2 R2 R1 R1
R1
R1
R1 IC2 +5 V 0.1 mF/25 V
TR2 TR3 f1A2 f2A2 f2A1 f1A1
IC1, 2: TC74AC04P TR1, 2, 3: 2SC1815-Y R1: 150 W R2: 1500 W
IC3
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TCD2950D
Caution
1. Window Glass
The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage.
2. Electrostatic Breakdown
Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. In handing the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. a. Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. b. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. c. Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range.
3. Incident Light
CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor.
4. Lead Frame Forming
Since this package is not strong against mechanical stress, you should not reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB.
5. Soldering
Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260C, or within three seconds for lead temperatures of up to 350C.
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TCD2950D
Package Dimensions
(Note1): (Note2): (Note3): Weight: 5.2 g (typ.)
TOP OF CHIP TO BOTTOM OF PACKAGE GLASS THICKNESS (n = 1.5) No.1 SENSOR ELEMENT (S1) TO CENTER OF No.1 PIN.
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TCD2950D
RESTRICTIONS ON PRODUCT USE
000707EBA
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice.
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2002-01-31


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